V4 - Prepare board for conductive cooling FMC
It may be possible to prepare the board for having conductive cooling for the FMC board. This will lower the temperature of the Mezzanine cards as they may transfer more heat to the PCIe carrier (which has a larger surface and is exposed to a larger airflow).
- Liberate region 3 (behind the FMC connector)
- Add copper around the area
- Note that we deliberately violate Rule 3.40 and will connect to Gnd, as is already done for the spacers and front-panel. This improves thermal and electrical properties.
- Design heat conductive mechanical bars
- Have separate bars for primary regions (1 and 3) and secondary
region (2)
- Having bars at the secondary region (2, on side) is likely counterproductive for many applications as it will block the airflow. Not having the region 2 bars will create a hybrid cooling (conductive and air-cooling).
- See observation 3.7 FMC spec (removal secondary ribs should be easy)
- Have separate bars for primary regions (1 and 3) and secondary
region (2)
Note that the Fine Delay module will have a conductive area 3 (and not 2).