Bug #770

All versions: via capping under IC17

Added by Tomasz Wlostowski on 09 Jul 2013 at 15:26. Updated on 28 May 2014 at 10:02.

Status:Closed Start date:2013-07-09
Priority:Low Due date:
Assignee:Tomasz Wlostowski % Done:

0%

Category:- Spent time: -
Target version:EDA-02267-V6-0

Description

The vias under IC17 should be marked as filled/capped in the PCB documentation for consistency with other QFN component thermal pads.

History

Updated by Erik van der Bij on 10 Apr 2014 at 14:55

  • Target version set to EDA-02267-V6-0

Updated by Tomasz Wlostowski on 27 May 2014 at 17:20

  • Assignee set to Tomasz Wlostowski
  • Status changed from New to Resolved

fixed in V6.

Updated by Erik van der Bij on 28 May 2014 at 10:02

  • Status changed from Resolved to Closed

Checked and OK.
Issue closed.

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