All versions: via capping under IC17
|Assignee:||Tomasz Wlostowski||% Done:||
The vias under IC17 should be marked as filled/capped in the PCB documentation for consistency with other QFN component thermal pads.
Updated by Tomasz Wlostowski on 27 May 2014 at 17:20
- Assignee set to Tomasz Wlostowski
- Status changed from New to Resolved
fixed in V6.