EMC2-DP - PC/104 OneBank Carrier for SoC Modules.
Project description
The EMC2-DP is a PCIe/104 OneBank Carrier for a Trenz compatible SoC
Module and has expansion for a VITA57.1 FMC LPC I/O board and also has
I/O pins, using a 100-way Samtec RazorBeam connectors system.
The add-on board, called “Sundance External Interface Connector – SEIC”
contains LEDs, RS232, USB2.0, HDMI, 1Gb Ethernet and SATA. The “SEIC”
can be customized for individual applications and bespoke connectors.
The PCIe/104 OneBank design enables the EMC2-DP to be added to robust and rugged installations.
This development is made under the EU TULIPP project.
Main Features
-
PCIe/104 OneBank Carrier for Trenz 4x5cm SoC Modules
-
PCI Express Gen 2 compatible and integrate PCI Express switch
-
Infinite number of EMC2-DP can be stacked for large I/O solutions
-
Expandable with any VITA57.1 FMC I/O Module for more flexibility
-
96 mm x 90 mm PC/104 Form-Factor with Cable-less Break-Out PCB Connector
-
8 electrical layers PCB
-
Licensed under CERN OHL v.1.2
-
Development made under the EU Artemis EMC2 project
Project information
- Block diagram (.pdf)
- Design Specification (.pdf)
- Starter Guide (.pdf)
- Pinout Compatibilities
- Board IO (.pdf)
- Master pinout (.xlsx)
- Trenz pinout Viewer/XDC-Generator (.xlsm)
Hardware
- Schematics (created with
OrCAD)
- Schematics (.pdf)
- Source files
- PCB (created with Zuken)
-
All layers (.pdf)
-
- Other
Software
- Demonstration examples
- HDMI Output Test example SDSoC Platform (16.2) for z7030.
- HDMI Loopback Test example
Contacts
Commercial producers
General question about project
Status
Date | Event |
---|---|
25-10-2013 | First draft |
19-06-2015 | V1 schematic finished |
06-10-2015 | First batch of V1 has been built |
16-02-2016 | V2 schematic issued |
29-04-2016 | First batch of V2 has been built |
11-05-2017 | Project added to ohwr.org |
19 May 2017