DI/OT Igloo2-based Radiation-tolerant System Board
Project description
The DI/OT System Board is one of the main components of the Distributed I/O Tier project ecosystem. It is mechanically and electrically compliant with the Compact PCI Serial standard (CPCI-S.0).
The DI/OT Radiation-tolerant System Board controls the DI/OT crate in radiation-exposed (or cost-sensitive applications, as an simpler alternative to the default, powerful Zynq Ultrascale-based System Board), offering low-speed communication with the Peripheral Boards over the backplane and with the higher layers of the control system using an FMC nanoFIP, or some other radiation-tolerant fieldbus, mounted on its FMC connector.
Related links and documents
- Official production files: EDMS EDA-04326-V2
- Board specification
- First schematic review
- Presentation about hydra
Contacts
- Greg Daniluk - CERN
- Christos Gentsos - CERN
Status
Date | Event |
---|---|
22-05-2020 | Project created, gathering specifications |
26-05-2020 | First draft of the specifications |
28-08-2020 | Schematic drawing started |
12-04-2021 | PCB layout being made |
07-05-2021 | PCB layout reviewed |
15-06-2021 | PCB layout finalised, production of prototypes starts |
21-07-2021 | Assembled prototypes received, board bring-up starts |
14-01-2022 | Successful functional evaluation of first 10 prototypes |
01-06-2022 | Radiation tests in Charm |
06-07-2023 | Received and successfully tested 3 prototypes of PCB v2, production of remaining 17 PCBs ongoing |
09-08-2023 | First System Board v2 tested in CHARM |