V1 - Problem with solder mask
There are 4 vias on the thermal pad of the IC11 on the FMC board (see in attached figure) which are uncovered with anti-soldering mask on the "etm" layer and covered on the "ebm" layer.
This create an effect called "ladle" which transports chemical product between different bath.
- Recommend to uncover these vias on the "ebm" layer with 0.35mm
- This recommendation is implemented by the PCB fabricator on the first production batch (4790415)