VME FMC Carrier VFC issueshttps://ohwr.org/project/fmc-vme-carrier/issues2019-02-12T08:43:23Zhttps://ohwr.org/project/fmc-vme-carrier/issues/1V2-0: Front-panel BOM wrong2019-02-12T08:43:23ZErik van der BijV2-0: Front-panel BOM wrong- Review arrangement-mat BOM. Refer to SVEC design.
See issue https://www.ohwr.org/work_packages/660 of the SVEC.
Also one can find in the BOM of the VFC a microswitch that is not used.
Need the following items:
- ELMA 66-514-26 - EMC Front Panels - Aluminium With EMC Gasket acc.
IEEE - Thickness 2.5m
- (actually the EMC Gasket is *not* included, despite the
description).
- ELMA 81-062-06 - EMC Gasket
- ELMA 81-095 - Top Black Handle with ESD Pin and Red button (includes
fixing screws to PCB)
- ELMA 81-096 - Bottom Black Handle with ESD Pin and Red Button
(includes fixing screws to PCB)
- ELMA 61-295 - Round head screw, cross recessed M2.5 x 12.7 - (two
needed)Andrea BoccardiAndrea Boccardihttps://ohwr.org/project/fmc-vme-carrier/issues/5DDR3 access problems2019-02-12T08:43:25ZErik van der BijDDR3 access problemsAccessing the DDR3 with the same core as used on the SPEC card doesn't
work. After several correct write and read cycles, the DDR3 returns all
F as data, likely caused by an unexpected recalibration cycle initiated
for unknown reasons.
Causes can be various (missing calibration resistor, unequal length A/D
lines, reflections, problems with Vref after starting up).
Needs debugging before design of V2.https://ohwr.org/project/fmc-vme-carrier/issues/29V1: PCB layout problem resulting in solder between pins2019-02-12T08:43:36ZErik van der BijV1: PCB layout problem resulting in solder between pinsOn several IC's, like IC5, IC7, IC9, some pins are connected to the mass
fill. Despite that there should be a solder mask present, on the
prototypes one finds neighbouring pins that both are connected to this
fill have solder between them.
Correct this layout for V2 of the boards.Andrea BoccardiAndrea Boccardi