VME FMC carrier
BreakDown
Project Status:Main Features
- 2 Spartan6 FPGA
- One dedicated to system tasks (S-FPGA)
- One fully available for the user applications (A-FPGA)
- 2 LPC (Low Pin Count) FMC slots
- 40 user defined single ended (20 LVDS) connections from the A-FPGA to P2 available for rear plug-in units (transition modules)
- flexible clocking resources
- 1 Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO)
- 1 any rate I2C programmable crystal oscillator
- 1 Direct Digital Synthesizer (DDS)
- 3 Phase Locked Loop (PLL) chips for clock cleaning and redistribution to the FPGAs and the pluggable modules
- Large amount of on board memory
- 2 completely independent 72Mbit ZBT SRAMS
- A 2Gbit DDR3
- 2 SPI 128Mbit flash proms for multiboot S-FPGA powerup configuration, storage of the A-FPGA firmware or of critical data
- Front panel connectivity
- 2 Small Formfactor Pluggable (SFP)
- 4 lemos configurable in all possible input/output combinations
- 1 e-SATA (only in non-VME applications)
- 12 layer printed circuit board
Documentation
Functional specifications
- Approved document: link
Technical specifications
- Official design data EDMS EDA-02030
- LHC equipment name: CVORK
- schematic diagram: link
- overview presentation: link
- bill of material: https://www.ohwr.org/project/fmc-vme-carrier/uploads/c4ede9892c00f168f95e4eac59ca7c87/BOM.xls
- Manufacturing test suite
Users
Status
Date | Event |
03-08-2009 | Functional specification written. |
24-03-2010 | PCB layout started |
10-05-2010 | Vadj fixed to 2.5V for FMC slot 2 to solve problems with bank power supplies. |
11-05-2010 | All active components ordered. |
23-06-2010 | Layout files received and being reviewed. |
05-07-2010 | PCB layout review held. |
09-08-2010 | PCB layout good for production. |
01-09-2010 | Simulation started. Many troubles getting connectivity files out of schematics. Redo by hand. |
15-09-2010 | PCB being produced at CERN. Expect assembled boards by mid October. |
06-10-2010 | Two PCB's being assembled. A third one will come later. |
15-10-2010 | Problem with solder mask for 0402 capacitors under BGA detected. PCB specification will be changed. |
19-10-2010 | 1st prototype received, waiting for the front panel. |
08-11-2010 | 1st prototype powered: 3 DC/DC are not working. |
09-11-2010 | 2nd and 3rd prototype received: one powered and no issues on the PS this time |
17-12-2010 | Test code loaded in the System FPGA and PROM programmed. JTAG and PROM loading are working. VME access OK. |
11-04-2011 | Ten additional boards produced. Two reworked and work, but have JTAG issues. Eight still need rework. |
11-04-2011 | Modifications to layout required. Can start in two to three weeks time. |
07-06-2011 | Start of sprint to debug the hardware design. 4 engineers intensively working on it, following the scrum methodology. |
24-06-2011 | End of sprint to debug hardware design. Uncovered 18 Issues. DDR3 memory and DDS not debugged yet. |
10-08-2011 | New version of schematics ready. |
16-08-2011 | Schematics design review held review16082011. The design office will layout from 24 August on. |
13-09-2011 | Schematics still being updated. The design office will layout from 19 September on. |
06-10-2011 | V2 layout ready. Needs schematics and PCB review. |
18-10-2011 | V2 schematics and PCB review held. |
25-10-2011 | Will produce 20 PCBs. First only 10 will be assembled. |
15-11-2011 | Expect assembled boards by mid- |
22-02-2012 | Ten assembled boards received. Needs patch on power plane. JTAG, VME and FPGA config work. |
30-09-2013 | Will produce 20 boards. |
Andrea Boccardi, Erik van der Bij - 30 September 2013