VME FMC Carrier HPC-DDR3 (VFC-HD)
Project description
The VFC-HD is an Altera Arria V based VME64x carrier for one High Pin Count (HPC) FPGA Mezzanine Card (FMC, VITA 57). It is has six SFP+ transceivers compatible with support for rad-hard GBT links, CERN Beam Synchronous Timing (BST), White Rabbit and Ethernet.
The card has been developed by the Beam Instrumentation (BI) group at CERN as a general purpose digital acquisition card. It replaces the VFC, which is no longer under development by BI.
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VFC-HD V3*
Main features
- Altera Arria V GX FPGA (5AGXMB1G4F40C4N)
- HPC FMC slot
- Fully populated LA, HA & HB banks
- 10 gigabit lanes connected to FPGA transceivers
- Programmable Vadj
- 6 SFP+ running up to 6.5Gbps
- 4 "application" SFPs for GBT connections
- 2 "system" SFPs for BST/White Rabbit & Ethernet
- 40 single ended (or 20 LVDS) connections to VME P2 available for rear transition modules
- 30 single ended connections to VME64x P0 to support clock & trigger distribution in (custom) BI LHC VME crates
- Flexible clocking resources
- Si570 10-280MHz programmable oscillator
- ADN2814 CDR for BST reception
- 125MHz & 20MHz VCXOs for White Rabbit support
- Si5338 clock synthesizer
- DDR3 memory on board
- Front panel connectivity:
- 6 SFP+ cages
- 4 LEMO-00 general purpose I/O
- 8 user LEDs
- 12 layer PCB
Project information
- Official design data EDMS EDA-03133
- LHC equipment name: HC-BOEVA
- Schematic diagram: EDA-03133-V3-0_sch.pdf
- Bill of material: EDA-03133-V3-0_pcb-mat.pdf
- Manufacturing test suite
Users
Contact
- Andrea Boccardi - CERN
Status
Date | Event |
08-10-2014 | Initial schematic review |
09-02-2015 | Inclusion of project on OHWR |
15-02-2015 | PCB layout finished by Norcott using CadStar |
16-02-2015 | Conversion of PCB to Altium & archival in EDMS started by CERN TE-MPE-EM |
25-03-2015 | V1 design finalised by TE-MPE-EM |
25-03-2015 | V1 prototype production launched (2 boards) |
10-06-2015 | V1 prototype received and under test |
17-06-2015 | All major functionality aside from DDR3 tested and working |
22-07-2015 | DDR3 SODIMM not working, decision made to change to soldered DDR3 |
10-02-2016 | V2 design finalised by TE-MPE-EM |
10-02-2016 | V2 prototype production launched (2 boards) |
12-04-2016 | V2 prototype received |
14-09-2016 | V3 design finalised by TE-MPE-EM |
23-09-2016 | V3 pre-series production launched (45 boards) |
28-11-2016 | V3 pre-series received |
Tom Levens - 30th July 2015