Only Bill of Materials was updated in version v3.3.1. No changed in PCB
schematics were made.
Instead of a P-channel MOSFETs we placed N-channel MOSFETs. The internal diode
will always conduct so the fans are always on. The control remaining drive
circuitry isn't placed.

Schematics:
------------

* C165 value changed from 100nF to 220nF
* VCC_IN of CDCM61002 (IC13) connected to +3V3
* RSTN pin of IC13 conected to a 47nF capacitor, not to +3V3
* QDRII_200CLK moved to OUT3 (LVPECL) of AD9516.
* Added LVDS termination resistor to adapt OUT3 to LVDS format
* CLK_OUT (EXTREF125MHZOUT) connected to OUT9 (CMOS) of AD9516-4.
* CLK_OUT transformer changed by 1:1 (WBC1-1LB)
* R253 and R254 resistor (Ethernet sheet) changed to 0402 size in order
to reduce items.
* Changed EXTPPSIN input stage in order to add 50 R termination
selectable by the FPGA.
* Name of nets QDRII_CLK and QDRII_200CLK changed to REF_CLK and
AUX_CLK.
* Input EXTREF_125M removed.
* QDRII IC42 chip removed.
* Added ouput from FPGA latched by an AD9516 clock. This output uses
the EXTREF_125M SMC connector:
	* Added LVPECL latch
	* Added LVPECL to LVTTL translator at the output
	* CLK0 input of IC12 changed to OUT6 of AD9516
	* FPGA VCCO Bank 26 changed to +2V5 to use LVPECL and LVDS
* Removed the six 0R resistor at the inputs of the AD5662 DACs
* FPGA Banks 26, 36 and 25 moved to "PFGA_Peripherals_Control" sheet.
* Connected the 3 free buffers SN74LVT125DW to the EXTPPSOUT output
signal.

PCB:
------

* GTX_DIFF signals routed on 90um/160um in order to reduce space,
allowing to pass between vias
* Some vias were moved from pads of some components to avoid the solder
paste flooding by the vía.
* IVT3200 VCO was moved to separate it of NAND Flash IC

Remove miniBackplane_SFP which was a copy of v3.2
Rename miniBackplane_18Ports_SFP_V3.3/ to mini_backplane_18SFP/
Rename miniBackplane_test/ to mini_backplane_test/

Fans connector changed by the P/N 61900211121 of Würth

Chassis hole for SCB changed, it was bad.
o.c. capacitor C42 between Chassis and a hole removed.

Clearance of polygon increased up to 0.2 mm (PCB manufacturing requirement)

PCB assembler suggestions added.

PCB assembler suggestions added.