clarify lvds length and version maj min

parent bed5fb92
......@@ -9,7 +9,7 @@
(title_block
(title "SIS1160 PCI-L I/O add on")
(date "2021-06-02")
(rev "0")
(rev "V0-0")
(company "Fernando Hueso-González - IFIC (CSIC/UV)")
(comment 1 "Funded by Generalitat Valenciana under grant number CDEIGENT/2019/11.")
(comment 2 "to interface with GPIO interconnect pins of the SIS1160 FMC carrier (Struck).")
......
......@@ -7,7 +7,7 @@
(title_block
(title "SIS1160 PCI-L I/O add on")
(date "2021-06-02")
(rev "0")
(rev "V0-0")
(company "Fernando Hueso-González - IFIC (CSIC/UV)")
(comment 1 "Funded by Generalitat Valenciana under grant number CDEIGENT/2019/11.")
(comment 2 "to interface with GPIO interconnect pins of the SIS1160 FMC carrier (Struck).")
......@@ -1459,11 +1459,11 @@
(effects (font (size 2.54 2.54)) (justify left bottom))
(uuid d1284965-35c9-4932-a78d-c1d11f5daa11)
)
(text "NOTES" (at 300.99 187.96 0)
(text "NOTES" (at 300.99 185.42 0)
(effects (font (size 2.54 2.54)) (justify left bottom))
(uuid eddfabf4-0a83-413f-a823-bd3725017d9f)
)
(text "Layer buildup is ML4-1mm. PCB thickness: 1mm\nGND - LVDS isolation height: 0.232 mm\nTrace edge-coupled surface microstrip width: 0.25 mm, gap: 0.20 mm, height: 0.035mm \nhttps://eu.beta-layout.com/pcb/technology/specifications/\nhttps://www.multi-circuit-boards.eu/en/pcb-design-aid/impedance-calculation.html"
(text "Layer buildup is ML4-1mm. PCB thickness: 1mm\nGND - LVDS isolation height: 0.232 mm\nAll LVDS are length and skew-matched to 100mm, but not the TTL.\nTrace edge-coupled surface microstrip width: 0.25 mm, gap: 0.20 mm, height: 0.035mm \nhttps://eu.beta-layout.com/pcb/technology/specifications/\nhttps://www.multi-circuit-boards.eu/en/pcb-design-aid/impedance-calculation.html"
(at 300.99 199.39 0)
(effects (font (size 1.27 1.27)) (justify left bottom))
(uuid 6272d202-300c-45be-92a6-dffe8dd56caf)
......
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