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# nanoFIP device characteristics
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nanoFIP is housed in an
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[Microsemi/ACTEL](http://www.actel.com/documents/PA3_DS.pdf) device with
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the following characteristics:
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<table>
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<tbody>
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<tr class="odd">
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<td><strong>Family</strong></td>
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<td>ProASIC3</td>
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</tr>
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<tr class="even">
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<td><strong>Die</strong></td>
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<td>A3P400</td>
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</tr>
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<tr class="odd">
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<td><strong>Packaging</strong></td>
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<td>208 PQFP</td>
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</tr>
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<tr class="even">
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<td><strong>Speed</strong></td>
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<td>STD</td>
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</tr>
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<tr class="odd">
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<td><strong>Die Voltage</strong></td>
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<td>1.5</td>
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</tr>
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<tr class="even">
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<td><strong>I/O Attributes</strong></td>
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<td>LVTTL</td>
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</tr>
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<tr class="odd">
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<td><strong>Junction Temperature</strong></td>
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<td>COM</td>
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</tr>
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<tr class="even">
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<td><strong>Factory preprogrammed unique programmed part number</strong></td>
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<td>A3P400-PQG208XW67</td>
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</tr>
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</tbody>
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</table>
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-----
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-----
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\_[Back to the Hints n' Tips Guide](DesignersHintsnTips)_
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*E.Gousiou, E.van der Bij, June 2012*
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