Components
List of components used in the design:
- Microsemi A3P400-1PQG208I (ProASIC3 nanoFIP FPGA)
- Alstom FieldTr (fieldbus transformer)
- Alstom FielDrive SSSB231 (fieldbus driver circuit)
The three components above are the main nanoFIP components already tested in irradiated areas (see nanoFIP test board and its radiation test report or FGClite).
- TI TPS7A4901DGNT (voltage regulator)
Positive LDO voltage regulator recommended by Salvatore Danzeca (radiation test report).
General purpose NPN transistor, tested in radiation (see the report).
-
74AHC1G04GW
CMOS inverter, used in radiation-tolerant nanoFipDiag
- Dialight 5710112F (double vertical R/G LED)
- Omron A6H-8102 (8x low profile dip switch)
- SAMTEC ASP-134604-01 (LPC FMC connector)
- Erni 154110
(low profile DB9 connector)
- possible alternative: (9 pin low-profile male D-Sub, 4-40 UNC locking): HARTING Elektronik 09661626817
- Zener diodes (BZV49-C3V9, BZV49-C4V7, BZV49-C6V2, BZV49-C8V2)
- hard to get, consider changing to (DZ2W03900L, DZ2W04700L, DZ2W06200L, DZ2W08200L; Mini2, used in RepeaFip) or (ZM4730A-GS08, ZM4732A-GS08, ZM4735A-GS08, ZM4738A-GS08; MELF/DO-213AB, available in huge quantities)
Connectors, passive components and DIP switches are not affected by radiation.