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jgabriel authored
1.- SCB_PLLs: C165 footprint changed to 0402 in order to remove this component and reduce boom. 2.- Connectors:CN1 Ethernet connector case connected to GND_SHIELD. 3.- CPU_100M_Ethernet:C206 changed from 470pF to 2,7nF in order to remove this component and reduce boom.Added R253 and R254 resistors (both 75R) between the Tr1 and C214. L10 is not mounted now. It connects GND_SHIELD and GND_ETH. 4.- QDRII_mem and QDRII_power: All the components of the QDRII memories will be not mounted.
27917ddc
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| Docs_PDF | ||
| LIBS | ||
| SCB | ||
| SCB_SAM9G45 | ||
| miniBackplane_SFP | ||
| miniBackplane_test | ||
| mini_backplane_simple |